We make the most of the technology we have cultivated for over 70 years to manufacture handcrafted products. Besides the standard product lineup, we are committed to developing individualized products to meet the various needs of customers. Our headquarters is based in Tokyo, Japan.
We can produce and offer everything related to plating, from conventional processes to cutting-edge technology, including simple jigs. We have a diverse product lineup and have acquired many patents on precision plating technology in the MEMS and semiconductor fields.
Our exhibits at our booth include the plating test equipment for wafers, a desktop-sized plating test system designed and manufactured with over 20 years of experience and know-how. It can precisely plate on silicon wafers, glass substrates, and films. Our equipment helps successfully prove reliable results in research and small-lot production manufactured for semiconductors, MEMS, LIGA, various sensors, solar power generation, batteries, aerospace industry, etc.
We look forward to introducing our products to you at our booth.